We are excited to be back at Pack Expo!
This year we are stepping things up as we will have our own dedicated booth themed around Quality, Integrity and Reliability. Taking center stage will be our new line-up of Packaging & Leak Test innovations. The VisionScan 3D, the Multi-Q HD and the EZ Blister+ will be on display side by side, a unique opportunity not to be missed.
If you would like to be one of the first to see our machines in action and get exclusive insights into our latest technologies, why not meet us at the show? You will find us in the West Hall, booth #W-14019. We appreciate your time is precious though. To avoid any waiting time, you can book a slot at the bottom of the page where you can also register for free access 🎫.
If Chicago is not in your planning this year, our latest innovations might still be of interest to you. You can find a short summary and highlights of our key products below. For more information or to discuss your requirements in more detail, please get in touch here.
The VisionScan 3D is a non-destructive and tool-less leak detection machine for blister packs of all foil types. The machine uses 3D technology in combination with differential pressure and vacuum to detect leaks in individual blister pockets as low as 5μm (pack and material dependent).
A non-destructive, deterministic and reliable Container Closure Integrity (CCI) test system. Utilising the vacuum decay standard test method (ASTM F2338-09), the Multi-Q HD enables ultra-sensitive detection of defects in pharmaceutical containers down to 1μm.
A 21 CFR part 11 compliant blister packaging machine for pharmaceutical companies that require low volumes. The system offers full traceability and electronic data storage capabilities.